Organic light emitting display device

ABSTRACT

The organic light emitting display device according to the exemplary aspect of the present disclosure includes a flexible substrate which includes a first area, a second area, and a bending area between the first area and the second area, and a wiring line on the bending area of the flexible substrate. The wiring line has a plurality of unit patterns having a rhombic shape. In this case, each of plurality of unit patterns shares a part of one side with the adjacent unit pattern. According to the organic light emitting display device according to an exemplary aspect of the present disclosure, a wiring line having a new shape is disposed in the bending area so that a stress which is applied to the wiring line and the protective layer formed in the bending area may be minimized.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 15/842,610 filed on Dec. 14, 2017 U.S. Pat. No. 10,546,908,which claims the priority of Korean Patent Application No.10-2016-0173945 filed on Dec. 19, 2016, in the Korean IntellectualProperty Office, all of which are hereby incorporated by reference intheir entireties as if fully set forth herein.

BACKGROUND Field of the Disclosure

The present disclosure relates to a display device, and moreparticularly, to an organic light emitting display device which canimplement a narrow bezel or bezel free.

Description of the Background

A display device which implements various information through a screenis a core device of the information communication era and has beenstudied to be developed as a display device which becomes thinner,lighter, and portable and displays a high quality image. Display devicesinclude an organic light emitting display device which is aself-emitting device, a plasma display device and a liquid crystaldisplay which requires a separate light source. Since the organic lightemitting display device is implemented without using a separate lightsource device, the organic light emitting display device can beimplemented as a flexible display device. In this case, a flexiblematerial such as plastic or metal foil is used for a substrate of theorganic light emitting display device.

In the meantime, when the organic light emitting display device isimplemented as a flexible display device, studies have been carried outto wrap or bend various parts of a display device using a flexibleproperty. Such studies are carried out mainly for new designs and UI/UXand in some cases, the studies are carried out to reduce a size of abezel of the display device.

As described above, when the substrate is bent in order to reduce a sizeof a bezel of the display device, a stress is intensively applied to awiring line disposed in an area to be bent, the wiring line may becracked. When the wiring line is cracked, the signals may not benormally transmitted so that a thin film transistor or an organic lightemitting element is not normally operated, which results in malfunctionof the light emitting display device.

SUMMARY

The present disclosure is to provide an organic light emitting displaydevice which implements a narrow bezel or bezel free.

Further, the present disclosure is to provide an organic light emittingdisplay device having a wiring line structure and a protective layerstructure which can minimize a stress applied to the wiring line and theprotective layer for protecting the wiring line formed in the bendingarea.

In addition, the present disclosure is to provide an organic lightemitting display device which can minimize the damage of the wiring linedue to disconnection or moisture permeation which is generated at thetime of bending.

The present disclosure is not limited to the above-mentioned aspects,and other aspects, which are not mentioned above, can be clearlyunderstood by those skilled in the art from the following descriptions.

According to an aspect of the present disclosure, there is provided anorganic light emitting display device including a flexible substratewhich includes a first area, a second area, a bending area between thefirst area and the second area, and a wiring line on the bending area ofthe flexible substrate. The wiring line has a plurality of unit patternshaving a rhombic shape. In this case, each of plurality of unit patternsshares a part of one side with the adjacent unit pattern. In the organiclight emitting display device according to the aspect of the presentdisclosure, a wiring line having a new shape is disposed in the bendingarea, so that a stress applied to the wiring line and the protectivelayer formed in the bending area may be minimized.

According to another aspect of the present disclosure, there is providedan organic light emitting display device including a flexible substratewhich includes a display area in which an organic light emitting elementis disposed, a first non-display area enclosing the display area, abending area extending from the first non-display area, and a secondnon-display area extending from one side of the bending area. A wiringline is disposed in the bending area of the flexible substrate. In thiscase, one outer edge of the wiring line includes a first protrudingportion and a second protruding portion which protrudes more than thefirst protruding portion and another outer edge of the wiring lineincludes a third protruding portion corresponding to the secondprotruding portion and a four protruding portion which protrudes morethan the third protruding portion and corresponds to the firstprotruding portion. A plurality of openings is arranged in a zigzag inthe wiring line.

According to another aspect of the present disclosure, there is providedan organic light emitting display device including a flexible substratewhich includes a first area, a second area, a bending area between thefirst area and the second area, and a wiring line on the bending area ofthe flexible substrate. The wiring line includes a plurality of firstwiring lines extending in a first direction and a plurality of secondwiring lines which extends in a second direction and connects twoadjacent first wiring lines among the plurality of first wiring lines.In this case, the plurality of second wiring lines is disposed to bespaced apart from each other along the first direction and a secondwiring line which is connected to one side of the plurality of firstwiring lines and a second wiring line which is connected to another sideare alternately disposed.

According to another aspect of the present disclosure, there is providedan organic light emitting display device comprising a flexible substrateincluding a first area, a second area, and a bending area between thefirst area and the second area; and a wiring line on the bending area ofthe flexile substrate, including first, second and third unit patterns,and having a rhombic shape, wherein the first, second and third unitpatterns share less than a full length of one side with adjacent unitpatterns and form four joints spreading out external pressure when theorganic light emitting display device is in a bending state.

Other detailed matters of the exemplary aspects are included in thedetailed description and the drawings.

According to the present disclosure, a wiring line having a newstructure is used so that a stress which is applied to the wiring lineand the protective layer formed in the bending area may be minimized.

Further, according to the present disclosure, when the bending isperformed, a phenomenon in that a crack is generated or moisturepermeates through the wiring line due to the crack of the protectivelayer disposed on the wiring line may be suppressed.

By doing this, the present disclosure may provide an organic lightemitting display device which implements a narrow bezel or bezel free.

The effects according to the present disclosure are not limited to thecontents exemplified above, and more various effects are included in thepresent specification.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a schematic plan view illustrating an organic light emittingdisplay device according to an exemplary aspect of the presentdisclosure;

FIG. 2 is a cross-sectional view taken along the line II-II′ of FIG. 1;

FIGS. 3A and 3B are plan views for explaining a shape of a wiring lineof an organic light emitting display device according to an exemplaryaspect of the present disclosure;

FIG. 4 is a schematic enlarged plan view of a wiring line of an organiclight emitting display device according to Comparative Example;

FIG. 5A is a schematic view illustrating a stress which is applied to awiring line when a bending area of an organic light emitting displaydevice according to Comparative Example is bent;

FIG. 5B is a schematic view illustrating a stress which is applied to aprotective layer which covers a wiring line when a bending area of anorganic light emitting display device according to Comparative Exampleis bent;

FIG. 6A is a schematic view illustrating a stress which is applied to awiring line when a bending area of an organic light emitting displaydevice according to an aspect of the present disclosure is bent;

FIG. 6B is a schematic view illustrating a stress which is applied to aprotective layer which covers a wiring line when a bending area of anorganic light emitting display device according to an aspect of thepresent disclosure is bent; and

FIGS. 7A and 7B are schematic enlarged plan views illustrating a wiringline of an organic light emitting display device according to anotherexemplary aspect of the present disclosure.

DETAILED DESCRIPTION

Advantages and characteristics of the present disclosure and a method ofachieving the advantages and characteristics will be clear by referringto exemplary aspects described below in detail together with theaccompanying drawings. However, the present disclosure is not limited toexemplary aspect disclosed herein but will be implemented in variousforms. The exemplary aspects are provided by way of example only so thata person of ordinary skilled in the art can fully understand thedisclosures of the present disclosure and the scope of the presentdisclosure. Therefore, the present disclosure will be defined only bythe scope of the appended claims.

The shapes, sizes, ratios, angles, numbers, and the like illustrated inthe accompanying drawings for describing the exemplary aspects of thepresent disclosure are merely examples, and the present disclosure isnot limited thereto. Further, in the following description of thepresent disclosure, a detailed explanation of known related technologiesmay be omitted to avoid unnecessarily obscuring the subject matter ofthe present disclosure. The terms such as “including,” “having,” and“consisting of” used herein are generally intended to allow othercomponents to be added unless the terms are used with the term “only”.Any references to singular may include plural unless expressly statedotherwise.

Components are interpreted to include an ordinary error range even ifnot expressly stated.

When the position relation between two parts is described using theterms such as “on”, “above”, “below”, and “next”, one or more parts maybe positioned between the two parts unless the terms are used with theterm “immediately” or “directly” is not used.

When an element or layer is disposed “on” other element or layer,another layer or another element may be interposed directly on the otherelement or therebetween.

Although the terms “first”, “second”, and the like are used fordescribing various components, these components are not confined bythese terms. These terms are merely used for distinguishing onecomponent from the other components. Therefore, a first component to bementioned below may be a second component in a technical concept of thepresent disclosure.

Like reference numerals generally denote like elements throughout thespecification.

A size and a thickness of each component illustrated in the drawing areillustrated for convenience of description, and the present disclosureis not limited to the size and the thickness of the componentillustrated.

In this specification, the flexible display device means a displaydevice having a flexibility and is also used as the same meaning as abendable display device, a rollable display device, an unbreakabledisplay device, a foldable display device, a twistable display device, astretchable display device, a wrinkable display device, and the like. Inthis specification, the flexible organic light emitting display devicemeans an organic light emitting display device among various flexibledisplay devices.

The features of various aspects of the present disclosure can bepartially or entirely adhered to or combined with each other and can beinterlocked and operated in technically various ways as understood bythose skilled in the art, and the aspects can be carried outindependently of or in association with each other.

Hereinafter, various exemplary aspects of the present disclosure will bedescribed in detail with reference to accompanying drawings.

FIG. 1 is a schematic plan view illustrating an organic light emittingdisplay device according to an exemplary aspect of the presentdisclosure. FIG. 2 is a cross-sectional view taken along the line II-II′of FIG. 1. Referring to FIGS. 1 and 2, an organic light emitting displaydevice 100 includes a supporting substrate 103, a flexible substrate110, a pad unit 112, a thin film transistor 130, an organic lightemitting element 140, an encapsulation layer 170, a wiring line 180, anda protective layer 125. In FIG. 1, the supporting substrate 103 isomitted and a specific shape of the thin film transistor 130 and theorganic light emitting element 140 disposed on the flexible substrate110 is omitted.

The flexible substrate 110 is a substrate which supports severalcomponents of the organic light emitting display device 100. Theflexible substrate 110 may be bent. For example, the flexible substrate110 may be bent in a horizontal direction, a vertical direction, or adiagonal direction. Therefore, the flexible substrate 110 may be bent ina combination of the vertical, horizontal, and diagonal directions,based on a design required for the organic light emitting display device100.

The flexible substrate 110 may be formed of a material havingflexibility so as to be bent. For example, the flexible substrate 110may be implemented by a thin plastic film formed of a polymer such aspolyimide, polyethylene naphthalate (PEN), and polyethyleneterephthalate (PET).

The flexible substrate 110 includes at least one active area A/A. Theactive area A/A is an area where the organic light emitting element 140is disposed. The display area means an area where an image is displayedand is referred to as a display area. At least one inactive area I/A maybe disposed around the active area A/A. That is, the inactive area I/Amay be adjacent to one or more sides of the active area A/A. Forexample, as illustrated in FIG. 1, the non-active area I/A encloses aquadrangular active area A/A. However, a shape of the active area A/Aand a shape and an arrangement of the inactive area I/A which is incontact with the active area A/A are not limited to the exampleillustrated in FIG. 1. The active area A/A and the inactive area I/A mayhave various shapes appropriate for a design of an electronic apparatusin which the organic light emitting display device 100 is mounted. Forexample, the active area may be formed in the form of a pentagon, ahexagon, a circle, or an ellipse.

The flexible substrate 110 includes a first area, a bending area B/Aextending from one side of the first area, and a second area extendingfrom one side of the bending area B/A. The first area may be defined asa non-bending area N/A including the active area A/A and the second areamay be defined as a non-bending area which is disposed in an oppositeside to the first area with respect to the bending area B/A.

A part of the flexible substrate 110 may be bent. For example, asillustrated in FIG. 1, a lower end of the active area A/A may be bent.That is, the bending area B/A of the flexible substrate 110 is bent.

Even though it is illustrated that the non-active area I/A of theflexible substrate 110 is bent in FIG. 1, a part of the active area A/Aof the flexible substrate 110 may be bent. In this case, an image may bedisplayed in an area of the active area A/A which is bent and theorganic light emitting display device 100 may substantially include aflat display area and a bent display area.

The pad unit 112 is disposed in the inactive area I/A of the second areaof the flexible substrate 110. For example, as illustrated in FIG. 1,the pad unit 112 is disposed in the inactive area I/A which is incontact with the active area A/A at the lower end of the flexiblesubstrate 110. The pad unit 112 is connected to a circuit film such asan FPCB and also functions as a contact terminal which connects thecircuit film and the wiring line 180 to each other.

In the active area A/A, the thin film transistor 130 which is connectedto the organic light emitting element 140 is disposed. The thin filmtransistor 130 operates in association with the driving unit 111 locatedin the inactive area I/A and controls a driving current amount which issupplied to the organic light emitting element 140.

The driving unit 111 is disposed in the inactive area I/A of theflexible substrate 110 and supplies a driving signal to the thin filmtransistor 130. For example, the driving unit 111 may be a gate drivingunit which supplies a gate signal to the thin film transistor 130. Thegate driving unit includes various gate driving circuits and the gatedriving circuits may be formed directly on the flexible substrate 110.In this case, the driving unit 111 may be referred to as a gate-in-panel(GIP).

Even though not illustrated in FIG. 1, a data driving unit whichsupplies a data signal to the thin film transistor 130 is mounted on aseparated printed circuit board (PCB) to be connected to the flexiblesubstrate 110 through a circuit film such as a flexible printed circuitboard (FPCB). The data driving unit may be disposed directly in the padunit 112 of the flexible substrate 110 by a chip-on-film (COF) manner.

In some exemplary aspects, various additional elements for generatingvarious signals or driving the organic light emitting element 140 in theactive area A/A may be provided on the flexible substrate 110. Forexample, an inverter circuit, a multiplexer, an electro staticdischarging circuit, and the like may be disposed on the flexiblesubstrate 110.

As illustrated in FIG. 2, in order to increase strength and/or rigidityin a specific part of the flexible substrate 110, one or more supportingsubstrates 103 are disposed below the flexible substrate 110. Forexample, the supporting substrate 103 is disposed only in thenon-bending area N/A. In this case, the supporting substrate 103 is notdisposed in a bending area B/A for which a flexibility for bending isrequired. That is, the supporting substrate 103 is disposed in a partialarea of the active area A/A in which the organic light emitting element140 is disposed and a partial area of the inactive area I/A in which thepad unit 112 is disposed, but is not disposed in the bending area B/A.The supporting substrate 103 supports the flexible substrate 110 suchthat the flexible substrate 110 is not rolled during a process offorming components, such as the thin film transistor 130, the organiclight emitting element 140, or the pad unit 112, on the flexiblesubstrate 110.

The supporting substrate 103 may be formed of a thin plastic film suchas polyimide, polyethylene naphthalate, polyethylene terephthalate, anda combination of other appropriate polymers. Further, the supportingsubstrate 103 may be implemented by a thin glass, a metal foil shieldedby a dielectric substance, or a polymer film in which a polymer materialcombined with a multilayered polymer, nano particles, or micro particlesis included.

A buffer layer 121 is disposed on the flexible substrate 110. The bufferlayer 121 may suppress moisture or impurities from permeating throughthe flexible substrate 110 and planarize an upper portion of theflexible substrate 110. The buffer layer 121 may be formed of amultilayered structure in which silicon nitride (SiN_(x)) and siliconoxide (SiO₂) are alternately laminated. However, the buffer layer 121may not be an essential component and whether to form the buffer layer121 may be determined depending on a type of the flexible substrate 110or a type of the thin film transistor 130.

The thin film transistor 130 is formed on the buffer layer 121. The thinfilm transistor 130 includes an active layer 131, a gate electrode 132,a source electrode 133, and a drain electrode 134. Specifically, theactive layer 131 is formed on the buffer layer 121 and a gate insulatinglayer 122 which insulates the active layer 131 from the gate electrode132 is formed on the active layer 131. Further, the gate electrode 132is formed on the gate insulating layer 122 to overlap the active layer131 and an interlayer insulating layer 123 is formed on the gateelectrode 132 and the gate insulating layer 122. The source electrode133 and the drain electrode 134 are formed on the interlayer insulatinglayer 123. The source electrode 133 and the drain electrode 134 areelectrically connected to the active layer 131. For the convenience ofdescription, in FIG. 2, only a driving thin film transistor isillustrated among various thin film transistors which may be included inthe organic light emitting display device 100. However, a switching thinfilm transistor or a capacitor may also be included in the organic lightemitting display device 100. Further, even though in the presentdisclosure, it is described that the thin film transistor 130 has acoplanar structure, a staggered thin film transistor 130 may also beused.

The active layer 131 may be formed of amorphous silicon (a-Si),polycrystalline silicon (poly-Si), an oxide semiconductor, or an organicsemiconductor. When the active layer 131 is formed of the oxidesemiconductor, the active layer 131 may be formed of ITO, IZO, indiumgallium zinc oxide (IGZO), or indium tin zinc oxide (ITZO), but is notlimited thereto.

The gate insulating layer 122 and the interlayer insulating layer 123are disposed on the buffer layer 121 and are formed of an inorganicinsulating material such as silicon nitride or silicon oxide. The gateinsulating layer 122 and the interlayer insulating layer 123 may beformed of a single layered structure or a multi-layered structure formedof an inorganic insulating material.

A passivation layer 124 is disposed so as to cover the thin filmtransistor 130. The passivation layer 124 may be formed of the sameinorganic insulating material as the gate insulating layer 122 or theinterlayer insulating layer 123 and protects the source electrode 134and the drain electrode 133 of the thin film transistor 130.

A planarization layer 150 is disposed on the passivation layer 124. Theplanarization layer 150 is a layer which planarizes an upper portion ofthe flexible substrate 110 and may be formed of an organic insulatingmaterial so as to cover a step of the upper portion of the flexiblesubstrate 110. For example, the planarization layer 150 may be formed ofat least one material of acrylates resin (polyacrylates resin), epoxyresin, phenolic resin, polyamides resin, polyimides rein, unsaturatedpolyesters resin, polyphenylenethers resin, polyphenylenesulfides resin,and benzocyclobutene, but is not limited thereto. The planarizationlayer 150 may be formed of a single layer, double layers or multiplelayers. The planarization layer 150 includes a contact hole whichelectrically connects the thin film transistor 130 to the anode 141.

The organic light emitting element 140 is disposed on the planarizationlayer 150 and includes an anode 141, an organic layer 142, and a cathode143. The anode 141 is an electrode which supplies holes to the organiclayer 142 and is connected to the thin film transistor 130. The anode141 may be formed of a transparent conductive material having a highwork function in order to supply holes to the organic layer 142. Thetransparent conductive material may include ITO, IZO, or ITZO, but isnot limited thereto. As illustrated in FIG. 2, when the organic lightemitting display device 100 is driven by a top emission method, theanode 141 may further include a reflector.

The cathode 143 is an electrode which supplies electrons to the organiclayer 142. The cathode 143 may be formed of a metal having a relativelylow work function, for example, silver, titanium (Ti), aluminum,molybdenum (Mo), or an alloy (Ag:Mg) of silver and magnesium. Asillustrated in FIG. 2, when the organic light emitting display device100 is driven by a top emission method, a metal layer which constitutesthe cathode 143 may have a very thin thickness so that the light passestherethrough. In some exemplary aspects, the cathode 143 may be formedof a transparent conductive material such as ITO, IZO, and ITZO.

The organic layer 142 is disposed between the anode 141 and the cathode143. The organic layer 142 includes an organic light emitting layer. Theorganic light emitting layer emits light having a specific wavelengthand may emit red light, green light, or blue light. In some exemplaryaspects, the organic light emitting layer may be configured by amultilayered structure in which a red light emitting layer emitting redlight, a green light emitting layer emitting green light, and a bluelight emitting layer emitting blue light are laminated to emit whitelight.

In addition to the organic light emitting layer, the organic layer 142may further include organic layers, such as an injecting layer or atransporting layer, which improve an emission efficiency of the organiclight emitting element 140. For example, in addition to the organiclight emitting layer, a hole injection layer or a hole transport layermay be further disposed between the anode 141 and the cathode 143 inorder to allow the holes to smoothly move.

A bank layer 161 is disposed on the planarization layer 150 and coversan edge of the anode 141. The bank layer 161 defines an emission areawhere the organic light emitting element 140 emits light. That is, thebank layer 161 is disposed to enclose the edge of the anode 141 andincludes an opening which defines the emission area. The anode 141, theorganic layer 142, and the cathode 143 may be sequentially laminated inan area corresponding to the opening of the bank layer 161. Since theorganic light emitting layer of the organic layer 143 emits light basedon the holes supplied from the anode 141 and the electrons supplied fromthe cathode 143, the organic light emitting element 140 may emit lightin an area corresponding to the opening of the bank layer 161. The banklayer 161 is formed of an insulating material to insulate the anodes 131of the adjacent sub pixels from each other. For example, the bank layer161 may be formed of one or more materials of polyimide resin,polyacrylic resin, and polystyrene resin, but is not limited thereto.According to some exemplary aspects, the bank layer 161 may beconfigured by a black bank having a high light absorption rate to avoidcolor mixture of light which is generated in the emission area.

A spacer 163 is disposed on the bank layer 161. The spacer 163 isdisposed to enclosure the opening of the bank layer 161 to protect theorganic layer 142 in the opening of the bank layer 161 from an externalpressure. The spacer 163 may be formed of the same resin composition asthe bank layer 161 and may be configured by a black spacer having a highlight absorption rate to avoid color mixture of the light. In someexemplary aspects, the bank layer 161 and the spacer 163 may be onestructure which is configured by the same material. In this case, thebank layer 161 and the spacer 163 may be formed by a patterning processusing a halftone mask.

An encapsulation layer 170 is disposed on the organic light emittingelement 140 to protect the organic light emitting element 140. Theencapsulation layer 170 blocks permeation of oxygen and moisture fromthe outside. When the organic light emitting element 140 is exposed tothe moisture or oxygen, a pixel shrinkage phenomenon in which theemission area is reduced may be generated or a dark spot may begenerated in the emission area. The encapsulation layer 170 may beformed of a multilayered structure in which an inorganic encapsulationlayer and an organic encapsulation layer are alternately laminated tominimize moisture or oxygen inflowing from the outside. For example, theencapsulation layer 170 may include a first inorganic encapsulationlayer, an organic encapsulation layer, and a second inorganicencapsulation layer.

For example, the first inorganic encapsulation layer 171 and the secondinorganic encapsulation layer 172 may be formed of an inorganicinsulating material, such as silicon nitride, silicon oxide, or aluminumoxide Al₂O₃, which has a low water vapor transmission rate (WVTR) toprotect the organic light emitting element 140 from the moisture.Further, the organic encapsulation layer which is disposed between thefirst inorganic encapsulation layer and the second inorganicencapsulation layer covers a step and foreign substances of a lowerportion to planarize an upper surface of the flexible substrate 110.

A wiring line 180 is formed on the flexible substrate 110. The wiringline 180 extends from the active area A/A to the inactive area I/A to beconnected to the pad unit 112. The wiring line 180 transmits variouselectric signals which are transmitted through the pad unit 112 to thedriving circuit such as the thin film transistor 130 disposed in theactive area A/A.

A part of the wiring line 180 which extends to the pad unit 112 disposedin the inactive area I/A in a lower end of the active area A/A isillustrated in FIG. 2. As mentioned above, the inactive area I/A towhich the wiring line 180 extends may be bent. Therefore, the wiringline 180 may extend from the non-bending area N/A where the flexiblesubstrate 110 is not bent to the bending area B/A.

The wiring line 180 may be formed of metal having excellentconductivity. For example, the wiring line 180 may be formed of the samemetal as the source electrode 133 or the drain electrode 134 of the thinfilm transistor 130. However, the wiring line 180 is not limited theretoand may be formed of the same metal as the gate electrode 132 of thethin film transistor 130.

Differently from the wiring lines disposed in the non-display area N/A,the wiring lines 180 disposed in the bending area B/A are applied with astress due to the bending of the flexible substrate 110. Therefore, thewiring lines disposed in the bending area need to be designed to bestrong against the stress and have a low resistance. Further, the wiringlines need to have sufficient flexibility to easily bend the flexiblesubstrate 110. For example, the wiring lines 180 may have a structurehaving a plurality of unit patterns having a rhombic shape. In thiscase, each of the plurality of unit patterns may share a part of oneside with an adjacent unit pattern. A specific shape of the wiring lines180 will be described below with reference to FIGS. 3A and 3B.

In the meantime, the wiring lines 180 may be formed of a single metallayer structure or formed of a multilayered structure in which aplurality of metal layers is laminated. Specifically, the wiring lines180 may be formed of two or more layers selected from aluminum (Al),titanium (Ti), molybdenum (Mo), and copper (Cu) layers. An example ofthe combination includes a structure (Ti/Al/Ti) in which an aluminumlayer is disposed between titanium layers, a structure (Mo/Al/Mo) inwhich an aluminum layer is disposed between molybdenum layers, astructure (Ti/Cu/Ti) in which a copper layer is disposed betweentitanium layers, and a structure (Mo/Cu/Mo) in which a copper layer isdisposed between molybdenum layers. The wiring lines 180 having theabove-described multilayered structure may have excellent conductivitydue to a low contact resistance between the metal layers whilemaintaining a sufficient flexibility.

The protective layer 125 is formed on the wiring lines 180 to suppresscorrosion or damage of the wiring lines 180. The protective layer 125 isformed to be in direct contact with all surfaces of the wiring line 180excluding a surface which is in contact with the flexible substrate 110to protect the wiring lines 180 from moisture or air which may penetratefrom the outside. In this case, when the protective layer 125 is seenfrom the top, the protective layer 125 may have substantially the sameshape as the wiring lines 180.

In this case, the protective layer 125 may be the same layer as thepassivation layer 124 which covers the thin film transistor 130 in thenon-bending area N/A. As illustrated in FIG. 2, the protective layer 125may be patterned to have the same shape as the shape of the wiring lines180, but is not limited thereto. When the protective layer 125 in thebending area B/A is patterned to have the same shape as the shape of thewiring line 180, the lowering of the flexibility of the flexiblesubstrate 110 due to the protective layer 125 may be minimized. Further,a problem in that the protective layer 125 is cracked due to the stresscaused by the bending of the flexible substrate 110 may be minimized.

FIGS. 3A and 3B are plan views for explaining a shape of a wiring lineof an organic light emitting display device according to an exemplaryaspect of the present disclosure. Specifically, FIG. 3A is a schematicenlarged plan view of an area A of FIG. 1. In FIG. 3A, the wiring line180 is represented by a dotted line and the protective layer 125 whichis disposed on the wiring line 180 is represented by a solid line. FIG.3B is a plan view illustrating only the wiring line 180 with a solidline by enlarging a partial area of FIG. 3A.

As mentioned above, differently from the wiring lines disposed in thenon-bending area N/A, the wiring lines 180 disposed in the bending areaB/A are applied with a stress due to the bending of the flexiblesubstrate 110. Therefore, the wiring lines disposed in the bending areaneed to have a shape and a structure strong against the stress. Further,components disposed on the bending area B/A need to have excellentflexibility so as to easily bend the flexible substrate 110 in thebending area B/A.

Referring to FIGS. 3A and 3B, the wiring line 180 includes a pluralityof unit patterns SP1, SP2, SP3, and SP4 having a rhombic shape. Morespecifically, referring to FIG. 3B, each of the unit patterns SP1, SP2,SP3, and SP4 includes a first sub wiring line SL1, a second sub wiringline SL2, a third sub wiring line SL3, and a fourth sub wiring line SL4.The second sub wiring line SL2 faces the first sub wiring line SL1 andis parallel to the first sub wiring line SL1. The third sub wiring lineSL3 forms an acute angle θ1 with the first sub wiring line SL1 and formsan obtuse angle with the second sub wiring line SL2. The fourth subwiring line SL4 faces the third sub wiring line SL3 and is parallel tothe third sub wiring line SL3. In each unit pattern SP1, SP2, SP3, andSP4, the first sub wiring line SL1, the second sub wiring line SL2, thethird sub wiring line SL3, and the fourth sub wiring line SL4 areconnected to have a rhombic shape, that is, a diamond shape patternstructure.

In this case, each of the unit patterns SP1, SP2, SP3, and SP4 shares apart of one sub wiring line with an adjacent unit pattern. Specifically,referring to FIG. 3B, the second sub wiring line SL2 of the first unitpattern SP1 and the first sub wiring line SL1 of the second unit patternSP2 are partially shared. Here, “partially sharing” means that one subwiring line of one unit pattern having a rhombic shape is formed topartially overlap one sub wiring line of an adjacent unit pattern. Here,a length d2 of the wiring line shared between the adjacent unit patternsis smaller than a length d1 of the sub wiring line of one unit pattern.

For example, referring to FIG. 3B, the first sub wiring line SL1 of thesecond unit pattern SP2 is formed to overlap the second sub wiring lineSL2 of the first unit pattern SP1 to form a first intersecting line SE1.Further, the third sub wiring line SL3 of the second unit pattern SP2 isformed to overlap the fourth sub wiring line SL4 of the third unitpattern SP3 to form a second intersecting line SE2. In this case, alength d2 of the first intersecting line SE1 is smaller than a length ofthe first sub wiring line SL1 of the second unit pattern SP2.

As described above, each unit pattern is configured to share a part ofone side with the adjacent unit pattern so that four joints are formedin one unit pattern. Specifically, referring to FIG. 3B, the second unitpattern SP2 includes a first joint J1, a second joint J2, a third jointJ3, and a fourth joint J4. The first joint J1 is a joint where the firstsub wiring line SL1 of the second unit pattern SP2 meets the third subwiring line SL3 of the first unit pattern SP1. The second joint J2 is ajoint where the fourth sub wiring line SL4 of the second unit patternSP2 meets the second sub wiring line SL2 of the first unit pattern SP1.The third joint J3 is a joint where the third sub wiring line SL3 of thesecond unit pattern SP2 meets the first sub wiring line SL1 of the thirdunit pattern SP3. The fourth joint J4 is a joint where the second subwiring line SL2 of the second unit pattern SP2 meets the fourth subwiring line SL4 of the third unit pattern SP3. In this case, each jointJ1, J2, J3, and J4 has a structure in which sub wiring lines extendingin three directions intersect each other.

In the meantime, referring to FIG. 3A, the wiring line includes a firstpattern and a second pattern in which a plurality of unit patterns isdisposed to be spaced apart from each other along a bending direction.In this case, a first line L1 which passes center points C1 of the unitpatterns of the first pattern is spaced apart from a second line L2which passes center points C2 of the unit patterns of the secondpattern. That is, the first pattern is a set of a plurality of unitpatterns which is spaced apart from each other in the bending directionand the second pattern is a set of a plurality of unit patterns which isspaced apart from each other in the bending direction. Referring to FIG.3B, the first pattern includes the first unit pattern SP1 and the thirdunit pattern SP3 and the second pattern includes the second unit patternSP2 and the fourth unit pattern SP4.

Each of the first pattern and the second pattern includes a plurality ofopenings by a plurality of unit patterns. By doing this, a plurality ofopenings is arranged in the wiring line in a zigzag fashion.

In this case, a spaced distance d3 between the first line L1 and thesecond line L2 is smaller than a spaced distance d4 between theoutermost edge of the unit patterns of the first pattern and the firstline L1 and is smaller than a spaced distance d5 between the outermostedge of the unit patterns of the second pattern and the second line L2.

In the meantime, the wiring line 180 includes a first protruding portionPR1 and a second protruding portion PR2 which are repeatedly disposed toone outer edge and a third protruding portion PR3 and a fourthprotruding portion PR4 which are repeatedly disposed to another outeredge. In this case, the second protruding portion PR2 protrudes morethan the first protruding portion PR1. Further, the third protrudingportion PR3 corresponds to the second protruding portion PR2 and thefourth protruding portion PR4 corresponds to the first protrudingportion PR1. In this case, the fourth protruding portion PR4 protrudesmore than the third protruding portion PR3.

Referring to FIG. 3A, the first protruding portion PR1 is an areaprotruding to a left outer edge of the unit patterns of the secondpattern and the second protruding portion PR2 is an area protruding to aleft outer edge of the unit patterns of the first pattern. Similarly,the third protruding portion PR3 is an area protruding to a right outeredge of the unit patterns of the first pattern and the fourth protrudingportion PR4 is an area protruding to a right outer edge of the unitpatterns of the second pattern.

As described above, the wiring line 180 has a plurality of openingshaving a rhombic shape. By doing this, the wiring line includes aplurality of repeated protruding portions PR1, PR2, PR3, and PR4 andincludes an opening formed in a zigzag in the wiring line 180. In thiscase, the first protruding portion PR1 and the third protruding portionPR3 are connected to each other so that the wiring line 180 forms anopening having a rhombic shape. In this case, a connecting wiring linewhich connects the first protruding portion PR1 and the third protrudingportion PR3 may be a side which is shared by the unit patterns, asillustrated in FIG. 3B.

In the meantime, referring to FIG. 3A, the protective layer 125 whichcovers the wiring line 180 is formed with a predetermined margin from anouter corner of the wiring line 180. Excluding the protective layer 125which covers the wiring line 180 with a predetermined margin, theprotective layer is not formed in other area. That is, the protectivelayer 125 is formed to have a shape corresponding to a shape of thewiring line 180. Therefore, a width of the protective layer 125 islarger than a width of the wiring line 180.

In the organic light emitting display device 100 according to anexemplary aspect of the present disclosure, the wiring line 180 may beused as a gate wiring line or a data wiring line.

The organic light emitting display device 100 according to the exemplaryaspect of the present disclosure uses a wiring line having a new shape,so that a stress which is applied to the wiring line and the protectivelayer formed in the bending area is minimized.

Specifically, when the bending area B/A of the flexible substrate 110 isbent, the wiring line 180 formed in the bending area B/A is applied witha stress in the bending direction. Specifically, a wiring line formed ina direction parallel to the bending direction of the bending area B/A isapplied with a stress which is larger than that of a wiring line formedin a direction which is different from the bending direction. Therefore,the wiring line formed in a direction parallel to the bending directionis highly likely to be cracked as compared with the wiring line formedin a direction which is different from the bending direction. In theorganic light emitting display device 100 according to the exemplaryaspect of the present disclosure, the wiring line 180 has a plurality ofunit patterns having a rhombic shape and each of the sub wiring lineswhich form the rhombic shape is disposed in a direction different fromthe bending direction. Therefore, as compared with a case when thewiring line is formed to be parallel to the bending direction of thebending area, a wiring line of a unit pattern having a rhombic shape mayreduce the stress.

In the meantime, the wiring line 180 of the organic light emittingdisplay device 100 according to an exemplary aspect of the presentdisclosure may reduce a stress which is applied to the wiring line 180as compared with a wiring line having a general mesh pattern. Morespecific description will be provided with reference to FIG. 4.

FIG. 4 is an enlarged schematic plan view of a wiring line of an organiclight emitting display device according to Comparative Example. FIG. 4illustrates a structure of a wiring line 280 having a general meshpattern and a protective layer 225.

Referring to FIG. 4, the general mesh pattern has a structure in which aplurality of rhombic patterns is formed in parallel along the bendingdirection. The wiring line 280 illustrated in FIG. 4 has a structure inwhich vertices of the plurality of rhombic patterns are connected. Morespecifically, the wiring line 280 illustrated in FIG. 4 branches at onepoint to include a first sub wiring line extending to a first directionwhich is different from the bending direction and a second sub wiringline extending to a second direction which is different from the firstdirection. In this case, the first sub wiring line and the second subwiring line are bent and gathered at another point to form a rhombicshape. As compared with the wiring line 180 disposed in the organiclight emitting display device 100 according to the exemplary aspect ofthe present disclosure illustrated in FIGS. 3A and 3B, differently fromthe wiring line 180 illustrated in FIGS. 3A and 3B in which four jointsare formed in one repeated pattern having a rhombic shape, the wiringline 180 illustrated in FIG. 4 has two joints X in one single pattern.In this case, each joint X is a point at which wiring lines extending infour directions intersect each other.

Specifically, the wiring lines 280 in four directions illustrated inFIG. 4 intersect at one joint X. In such a structure, when the bendingarea B/A of the flexible substrate is bent, the stress is intensivelyapplied to one joint X from the wiring lines in four directions. Incontrast, in the wiring line 180 illustrated in FIG. 3B, the joints J1,J2, J3, and J4 are intersection points of wiring lines extending inthree directions. Therefore, the stress is concentrated to individualjoints J1, J2, J3, and J4 from the wiring lines in three directions.Therefore, when the bending area B/A is bent, a pressure which isapplied to the joints J1, J2, J3, and J4 of the wiring line 180illustrated in FIG. 3B is lower than a pressure which is applied to thejoint X of the wiring line 280 illustrated in FIG. 4. Therefore, apossibility of crack at the joint of the wiring line is lowered.Therefore, in the organic light emitting display device 100 according tothe exemplary aspect of the present disclosure, a failure which may becaused by the cracked wiring line 180 may be minimized.

Further, similar to the wiring line 180, the protective layer 125 whichencloses the wiring line 180 may also minimize a stress which is appliedto the protective layer 125 due to the structural characteristic.Therefore, the crack which is generated in the protective layer 125 whenthe flexible substrate 110 is bent is suppressed so that a phenomenon inwhich moisture permeates the wiring line 180 when the protective layer125 is cracked may be suppressed.

Hereinafter, an effect that the stress applied to the wiring linedisposed in the bending area of the organic light emitting displaydevice 100 according to the exemplary aspect of the present disclosureis reduced will be described in detail using Examples. However, thefollowing Examples are set forth to illustrate the present disclosure,but the scope of the present disclosure is not limited thereto.

Example 1 of the present disclosure is a wiring line structureillustrated in FIGS. 3A and 3B and Comparative Example 1 is a wiringline structure illustrated in FIG. 4. In order to identify a stresswhich is applied to each wiring line and protective layer when wiringline structures of Example 1 and Comparative Example 1 are bent, adegree of a stress which is applied to the wiring line and theprotective layer when a flexible substrate on which the wiring line andthe protective layer are disposed is bent with a radius of curvature of0.33R is schematically illustrated using an engineering simulationprogram ANSYS. In this case, it is assumed that the flexible substrate,the wiring line, and the protective layer which configure the wiringline structure of Example 1 and Comparative Example 1 are formed of thesame material and have the same physical property. Specifically, aYoung's modulus and a Poisson's ratio of the substrate are set to be26.273 GPa and 0.34, respectively and a Young's modulus and a Poisson'sratio of the wiring line are set to be 154.0 GPa and 0.25, respectively.Further, a Young's modulus and a Poisson's ratio of the protective layerare set to be 0.71 Pa and 0.33, respectively. Further, in the rhombicunit pattern which configures the wiring line in the wiring linestructure illustrated in Examples 1 and 2, a length of a sub wiring linewhich configures a corner is 24 μm, a width of the sub wiring line is3.7 μm, and an acute angle formed by the sub wiring lines is 33°. Athickness of the wiring line is 5000 Å. Further, in the protective layerwhich covers the wiring line, a width of an area extending from an outercorner of the wiring line is 1.5 μm and a thickness of the protectivelayer is 2000 Å. A simulation result which shows a stress of the wiringline structure of Example 1 and Comparative Example 1 is illustrated inFIGS. 5A, 5B, 6A, and 6B.

FIG. 5A is a schematic view illustrating a stress which is applied to awiring line when a bending area of an organic light emitting displaydevice according to Comparative Example is bent. FIG. 5B is a schematicview illustrating a stress which is applied to a protective layer whichcovers a wiring line when a bending area of an organic light emittingdisplay device according to Comparative Example is bent. FIG. 6A is aschematic view illustrating a stress which is applied to a wiring linewhen a bending area of an organic light emitting display deviceaccording to Example of the present disclosure is bent. FIG. 6B is aschematic view illustrating a stress which is applied to a protectivelayer which covers a wiring line when a bending area of an organic lightemitting display device according to Example of the present disclosureis bent. In FIGS. 5A, 5B, 6A, and 6B, the larger the density of thepoints, the greater the stress applied to the area.

Referring to FIGS. 5A and 6A, it is confirmed that as compared with thewiring line of Example 1, in the wiring line of Comparative Example 1,there is an area where a great stress is partially applied. Similarly,referring to FIGS. 5B and 6B, as compared with the protective layer ofExample 1, a strong stress is entirely applied to the protective layerof Comparative Example 1 at the time of bending. In this case, themaximum stress among stresses illustrated in FIGS. 5A, 5B, 6A, and 6B isrepresented in the following Table 1.

TABLE 1 Classification Example 1 Comp. Ex. 1 Maximum stress  14.3 MPa 21.0 MPa of wiring line Maximum stress 1886.3 MPa 2717.8 MPa ofprotective layer

As seen from Table 1, the wiring line structure of Example 1 which has aplurality of rhombic unit patterns and has a structure in which each ofthe plurality of unit patterns shares a part of one side with anadjacent unit pattern. Therefore, it is confirmed that a wiring linestructure of Example 1 in which joints are connected to three sub wiringlines has a reduced stress as compared with the wiring line structure ofComparative Example 1 which has a plurality of rhombic unit patterns andin which joints are connected to four sub wiring lines. For example, astress which is applied to the wiring line is reduced by 30% of themaximum stress. Similarly, a stress which is applied to the protectivelayer is reduced by 30% of the maximum stress.

FIGS. 7A and 7B are plan views for explaining a shape of a wiring lineof an organic light emitting display device according to anotherexemplary aspect of the present disclosure. Specifically, FIG. 7A is anenlarged schematic plan view illustrating a wiring line 380 and aprotective layer 325 disposed on a flexible substrate of an organiclight emitting display device according to another exemplary aspect ofthe present disclosure. In FIG. 7A, the wiring line is represented by adotted line and the protective layer disposed on the wiring line isrepresented by a solid line. FIG. 7B is an enlarged schematic plan viewillustrating only the wiring line with a solid line by enlarging apartial area of FIG. 7A.

The wiring line 380 illustrated in FIGS. 7A and 7B have a structure inwhich a plurality of rhombic unit patterns is continuously disposedvertically and horizontally, like a grid shape. In this case, theplurality of rhombic unit patterns shares a part of one side with anadjacent unit pattern. In the wiring line 180 illustrated in FIG. 3A,the rhombic openings formed by the plurality of unit patterns arearranged in a zigzag. In contrast, in the wiring line 380 illustrated inFIGS. 7A and 7B, rhombic openings formed by the plurality of unitpatterns are arranged in the form of a net.

More specifically, referring to FIG. 7B, the wiring line 380 illustratedin FIGS. 7A and 7B includes a plurality of first wiring lines ML1extending in a first direction D1 and a plurality of second wiring linesML2 which extends to a second direction D2 which is different from thefirst direction D1. The plurality of second wiring lines ML2electrically connects two adjacent first wiring lines ML1 among theplurality of first wiring lines. The first wiring lines ML1 are wiringlines which are arranged long in the first direction D1. The pluralityof second wiring lines ML2 may have a pattern shape disposed between thefirst wiring lines ML1 in the second direction D2 so that the adjacentfirst wiring lines ML1 are connected to each other. In this case, thewiring line 380 illustrated in FIGS. 7A and 7B may form a rhombicopening by two adjacent first wiring lines ML1 and two second wiringlines ML2 which are disposed between two adjacent first wiring linesML1.

In this case, a second wiring line ML2 a which is connected to one sidewith respect to one first wiring line ML1 and a second wiring line ML2 bwhich is connected to the other side are alternately arranged. That is,a joint where the second wiring line ML2 a which is connected to a rightside with respect to the first wiring line ML1 and the first wiring linemeet does not overlap a joint where the second wiring line ML2 b whichis connected to a left side and the first wiring line meet. That is, thesecond wiring line ML2 a connected to the right side of the plurality ofthe first wiring lines ML1 and the second wiring line ML2 b connected tothe left side are arranged in a zigzag pattern.

In this case, a part of the second wiring line ML2 is connected to anend of at least one first wiring line ML1 to form a left end or a rightend of the wiring line 380 with respect to the bending direction. Inthis case, the joint where the second wiring line ML2 and the firstwiring line ML1 meet may be a structure formed from two wiring lines.

Similar to the wiring line 180 illustrated in FIGS. 3A and 3B, thewiring line 380 illustrated in FIGS. 7A and 7B has a commoncharacteristic in that a plurality of unit patterns having a rhombicshape is provided and a unit pattern and an adjacent unit pattern sharea part of one side. Therefore, as compared with a structure in whichfour wiring lines meet at one joint, a stress applied to the joint whenthe metal is bent is reduced.

The wiring line 380 illustrated in FIGS. 7A and 7B may be easily usedwhen a low electrical resistance is required or a high voltage isapplied. For example, in the organic light emitting display device, thewiring line 380 illustrated in FIGS. 7A and 7B may be used as a VSSwiring line or a VDD wiring line.

In the meantime, in the wiring line structure illustrated in FIGS. 7Aand 7B, shapes of the wiring line and the opening are not limited by theexample illustrated in FIGS. 7A and 7B.

The exemplary aspects of the present disclosure can also be described asfollows:

According to an aspect of the present disclosure, an organic lightemitting display device includes a flexible substrate which includes afirst area, a second area, and a bending area between the first area andthe second area and a wiring line on the bending area of the flexilesubstrate in which the wiring line includes a plurality of unit patternshaving a rhombic shape and each of the plurality of unit patterns sharesa part of one side with an adjacent unit pattern.

The plurality of unit patterns may be arranged in a zigzag along abending direction.

The wiring line may include a first pattern in which the plurality ofunit patterns is spaced apart from each other along a bending directionand a second pattern in which the plurality of unit patterns is spacedapart from each other along the bending direction, and a first linewhich passes a center point of the plurality of unit patterns with thefirst pattern may be spaced apart from a second line which passes acenter point of the plurality of unit patterns with the second pattern.

A distance spaced between the first line and the second line may beshorter than a distance spaced between an outermost edge of the firstpattern and the first line and a distance spaced between an outermostedge of the second pattern and the second line.

Each of the plurality of unit patterns may include a first sub wiringline, a second sub wiring line which faces the first sub wiring line, athird sub wiring line which forms an acute angle with the first subwiring line and forms an obtuse angle with the second wiring line, and afourth sub wiring line which faces the third sub wiring line. Two subwiring lines among the first sub wiring line, the second sub wiringline, the third sub wiring line, and the fourth sub wiring line of eachof the plurality of unit patterns may be shared with another adjacentunit pattern.

A length of an intersecting line at which sub wiring lines of twoadjacent unit patterns among the plurality of unit patterns meet may beshorter than a length of the sub wiring line of the unit pattern.

The wiring line may be horizontally asymmetric with respect to thebending direction.

According to another aspect of the present disclosure, an organic lightemitting display device includes a flexible substrate which includes adisplay area in which an organic light emitting element is disposed, afirst non-display area enclosing the display area, a bending areaextending from the first non-display area, and a second non-display areaextending from one side of the bending area and a wiring line disposedin the bending area of the flexile substrate in which one outer edge ofthe wiring line includes a first protruding portion and a secondprotruding portion which protrudes more than the first protrudingportion, another outer edge of the wiring line includes a thirdprotruding portion corresponding to the second protruding portion and afour protruding portion which protrudes more than the third protrudingportion and corresponds to the first protruding portion, and a pluralityof openings is arranged in a zigzag in the wiring line.

Each of the plurality of openings may have a rhombic shape and thewiring line may include a connection line which connects between thefirst protruding portion and the third protruding portion so as todefine the plurality of openings.

The wiring line may be a data line or a gate line.

According to yet another aspect of the present disclosure, an organiclight emitting display device includes: a flexible substrate whichincludes a first area, a second area, and a bending area between thefirst area and the second area and a wiring line on the bending area ofthe flexile substrate in which the wiring line includes a plurality offirst wiring lines extending in a first direction and a plurality ofsecond wiring line which extends in a second direction and connects twoadjacent first wiring lines among the plurality of first wiring lines,the plurality of second wiring lines is disposed to be spaced apart fromeach other along the first direction, and a second wiring line which isconnected to one side of the plurality of first wiring lines and asecond wiring line which is connected to another side are alternatelydisposed.

A second wiring line which is connected to one side of each of theplurality of first wiring lines and a second wiring line connected toanother side may be disposed in a zigzag.

The first wiring line and the second wiring line may form a plurality ofrhombic patterns and joints formed by the plurality of first wiringlines and the plurality of second wiring lines may be intersectionpoints of the wiring lines extended from three different directions.

A part of the plurality of second wiring lines may be in contact with anend of the first wiring line.

The wiring line may be a VDD line or a VSS line.

Although the exemplary aspects of the present disclosure have beendescribed in detail with reference to the accompanying drawings, thepresent disclosure is not limited thereto and may be embodied in manydifferent forms without departing from the technical concept of thepresent disclosure. Therefore, the exemplary aspects of the presentdisclosure are provided for illustrative purposes only but not intendedto limit the technical spirit of the present disclosure. The scope ofthe technical spirit of the present disclosure is not limited thereto.Therefore, it should be understood that the above-described exemplaryaspects are illustrative in all aspects and do not limit the presentdisclosure. The protective scope of the present disclosure should beconstrued based on the following claims, and all the technical conceptsin the equivalent scope thereof should be construed as falling withinthe scope of the present disclosure.

What is claimed is:
 1. An organic light emitting display device,comprising: a flexible substrate which includes a display area in whichan organic light emitting element is disposed, a first non-display areaenclosing the display area, a bending area extending from the firstnon-display area, and a second non-display area extending from one sideof the bending area; and a wiring line disposed in the bending area ofthe flexile substrate, wherein one outer edge of the wiring lineincludes a first protruding portion and a second protruding portionwhich protrudes more than the first protruding portion, another outeredge of the wiring line includes a third protruding portioncorresponding to the second protruding portion and a four protrudingportion which protrudes more than the third protruding portion andcorresponds to the first protruding portion, and a plurality of openingsis arranged in a zigzag pattern in the wiring line.
 2. The organic lightemitting display device according to claim 1, wherein each of theplurality of openings has a rhombic shape and the wiring line includes aconnection line which connects between the first protruding portion andthe third protruding portion so as to define the plurality of openings.3. The organic light emitting display device according to claim 1,wherein the wiring line is a data line or a gate line.
 4. The organiclight emitting display device according to claim 1, wherein the wiringline includes a plurality of unit patterns, each of the plurality ofunit patterns includes: a first sub wiring line; a second sub wiringline which faces the first sub wiring line; a third sub wiring linewhich forms an acute angle with the first sub wiring line and forms anobtuse angle with the second sub wiring line; and a fourth sub wiringline which faces the third sub wiring line, and the first, second, thirdand fourth sub wiring line define each of the plurality of openings. 5.The organic light emitting display device according to claim 4, whereinplurality of unit patterns includes a first unit patterns and a secondunit pattern, a first sub wiring line of the first unit and a third subwiring line of the first unit contact each other to form the firstprotruding portion, a second sub wiring line of the first unit and afourth sub wiring line of the first unit contact each other to form thefourth protruding portion, a first sub wiring line of the second unitand a third sub wiring line of the second unit contact each other toform the second protruding portion, and a second sub wiring line of thesecond unit and a fourth sub wiring line of the second unit contact eachother to form the third protruding portion.
 6. The organic lightemitting display device according to claim 5, wherein the first patternin which the plurality of unit patterns is spaced apart from each otheralong a bending direction; the second pattern in which the plurality ofunit patterns is spaced apart from each other along the bendingdirection; a first line passing a center point of the plurality of unitpatterns of the first pattern; and a second line passing a center pointof the plurality of unit patterns of the second pattern, wherein thefirst and second lines are spaced apart from each other.
 7. The organiclight emitting display device according to claim 6, wherein a distancebetween the first line and the second line is shorter than a distancebetween an outermost edge of the first pattern and the first line and adistance between an outermost edge of the second pattern and the secondline.
 8. The organic light emitting display device according to claim 4,wherein two sub wiring lines of the first sub wiring line, the secondsub wiring line, the third sub wiring line, and the fourth sub wiringline of each of the plurality of unit patterns are shared with anotheradjacent unit pattern.
 9. The organic light emitting display deviceaccording to claim 8, wherein the two sub wiring lines of two adjacentunit patterns among the plurality of unit patterns have an overlappingportion shorter than a length of the sub wiring line of the unitpattern.
 10. The organic light emitting display device according toclaim 4, wherein the plurality of unit patterns includes first, secondand third unit patterns, and having a rhombic shape, wherein the first,second and third unit patterns share less than a full length of one sidewith adjacent unit patterns and form four joints spreading out externalpressure when the organic light emitting display device is in a bendingstate.
 11. The organic light emitting display device according to claim10, wherein the first, second and third unit patterns are arranged in azigzag pattern along a bending direction.